Intel® Core™2 Duo Processors |
|
Code Name |
Process |
Platform |
Other Memo |
Conroe |
65nm |
Desktop |
Dual-Core |
Allendale |
65nm |
Desktop |
Dual-Core |
Wolfdale |
45nm |
Desktop |
Dual-Core |
Wolfdale-3M |
45nm |
Desktop |
Dual-Core |
不明 |
45nm |
Desktop? |
Core2 Duo E3000シリーズ , Dual-Core , 他不明 |
Merom |
65nm |
Mobile |
Dual-Core , standard-voltage , low-voltage |
Merom-2M |
65nm |
Mobile |
Dual-Core , standard-voltage , ultra-low-voltage |
Penryn |
45nm |
Mobile |
Dual-Core , standard-voltage , medium-voltag
medium-voltage Small Form Factor ,
low-voltage Small Form Factor
|
Penryn-3M |
45nm |
Mobile |
Dual-Core , standard-voltage , medium-voltage
ultra-low-voltage Small Form Factor |
External links |
製品詳細(English) , 製品情報(Japanese) , 基本技術詳細 |
Conroe , 65nm , Dual-Core Desktop Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology
The E6540 does not support Intel Trusted Execution Technology.
Die size: 143 mm² |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
EV |
CV(MHz) |
E6300 |
SL9SA |
B2 |
1866 MHz |
266 * 7 |
2048 KB |
1066 |
0.85 - 1.3525 |
65 |
LGA 775 |
HH80557PH0362M |
2.380 |
4441 |
E6320 |
SLA4U |
B2 |
1866 MHz |
266 * 7 |
4096 KB |
1066 |
1.187 - 1.325 |
65 |
LGA 775 |
HH80557PH0364M |
2.530 |
4121 |
E6400 |
SL9S9 |
B2 |
2133 MHz |
266 * 8 |
2048 KB |
1066 |
0.85 - 1.3525 |
65 |
LGA 775 |
HH80557PH0462M |
2.380 |
5077 |
E6420 |
SLA4T |
B2 |
2133 MHz |
266 * 8 |
4096 KB |
1066 |
1.187 - 1.325 |
65 |
LGA 775 |
HH80557PH0464M |
2.530 |
5396 |
E6540 |
SLAA5 |
G0 |
2333 MHz |
333 * 7 |
4096 KB |
1333 |
0.962 - 1.350 |
65 |
LGA 775 |
HH80557PJ0534M |
2.580 |
6019 |
E6550 |
SLA9X |
G0 |
2333 MHz |
333 * 7 |
4096 KB |
1333 |
0.962 - 1.350 |
65 |
LGA 775 |
HH80557PJ0534MG |
2.580 |
6019 |
E6600 |
SL9S8
SL9ZL |
B2 |
2400 MHz |
266 * 9 |
4096 KB |
1066 |
0.85 - 1.3525 |
65 |
LGA 775 |
HH80557PH0564M |
2.530 |
6072 |
E6700 |
SL9S7
SL9ZF |
B2 |
2667 MHz |
266 * 10 |
4096 KB |
1066 |
0.85 - 1.3525 |
65 |
LGA 775 |
HH80557PH0674M |
2.530 |
6748 |
E6750 |
SLA9V |
G0 |
2667 MHz |
333 * 8 |
4096 KB |
1333 |
0.962 - 1.350 |
65 |
LGA 775 |
HH80557PJ0674MG |
2.580 |
6881 |
E6850 |
SLA9U |
G0 |
3000 MHz |
333 * 9 |
4096 KB |
1333 |
0.962 - 1.350 |
65 |
LGA 775 |
HH80557PJ0804MG |
2.580 |
7740 |
Allendale , 65nm , Dual-Core Desktop Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Trusted Execution Technology
Virtualization Technology
supported by: E6x00 Die
size: 111 mm² |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
EV |
CV(MHz) |
E4300 |
SL9TB |
L2 |
1800 MHz |
200 * 9 |
2048 KB |
800 |
1.225 - 1.325 |
65 |
LGA 775 |
HH80557PG0332M |
2.280 |
4104 |
E4400 |
SLA3F |
L2 |
2000 MHz |
200 * 10 |
2048 KB |
800 |
1.162 - 1.312 |
65 |
LGA 775 |
HH80557PG0412M |
2.280 |
4560 |
SLA98 |
M0 |
0.962 - 1.325 |
E4500 |
SLA95 |
M0 |
2200 MHz |
200 * 11 |
2048 KB |
800 |
0.962 - 1.325 |
65 |
LGA 775 |
HH80557PG0492M |
2.280 |
5016 |
E4600 |
SLA94 |
M0 |
2400 MHz |
200 * 12 |
2048 KB |
800 |
1.162 - 1.312 |
65 |
LGA 775 |
HH80557PG0562M |
2.280 |
5472 |
E4700 |
SLALT |
M0 |
2600 MHz |
200 * 13 |
2048 KB |
800 |
1.162 - 1.312 |
65 |
LGA 775 |
HH80557PG0642M |
2.280 |
5928 |
E6300 |
SL9TA |
L2 |
1866 MHz |
266 * 7 |
2048 KB |
1066 |
1.225 - 1.325 |
65 |
LGA 775 |
HH80557PH0362M |
2.380 |
4441 |
E6400 |
SL9T9 |
L2 |
2133 MHz |
266 * 8 |
2048 KB |
1066 |
1.225 - 1.325 |
65 |
LGA 775 |
HH80557PH0462M |
2.380 |
5077 |
Wolfdale , 45nm , Dual-Core Desktop Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology], Trusted Execution Technology.
E8190 does not support Intel Trusted Execution Technology.
Die size: 107 mm² |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
EV |
CV(MHz) |
E8190 |
SLAQR |
C0 |
2667 MHz |
333 * 8 |
6144 KB |
1333 |
0.85 – 1.3625 |
65 |
LGA 775 |
EU80570PJ0676MN |
2.655 |
7081 |
E8200 |
SLAPP |
C0 |
2667 MHz |
333 * 8 |
6144 KB |
1333 |
0.85 – 1.3625 |
65 |
LGA 775 |
EU80570PJ0676M |
2.655 |
7081 |
E8300 |
April 20, 2008 |
C0 |
2833 MHz |
333 * 8.5 |
6144 KB |
1333 |
0.85 – 1.3625 |
65 |
LGA 775 |
EU80570PJ0736M |
2.655 |
7522 |
E8400 |
SLAPL |
C0 |
3000 MHz |
333 * 9 |
6144 KB |
1333 |
0.85 – 1.3625 |
65 |
LGA 775 |
EU80570PJ0806M |
2.655 |
7965 |
E8500 |
SLAPK |
C0 |
3166 MHz |
333 * 9.5 |
6144 KB |
1333 |
0.85 – 1.3625 |
65 |
LGA 775 |
EU80570PJ0876M |
2.655 |
8406 |
E8600 |
2008 Q3 |
C0 |
3333 MHz |
333 * 10 |
6144 KB |
1333 |
0.85 – 1.3625 |
65 |
LGA 775 |
? |
2.655 |
8849 |
Wolfdale-3M , 45nm , Dual-Core Desktop Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management)
Die size: 107 mm² |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
EV |
CV(MHz) |
E7200 |
SLAPC
SLAVN |
M0 |
2533 MHz |
266 * 9.5 |
3072 KB |
1066 |
0.85 – 1.3625 |
65W |
LGA 775 |
EU80571PH0613M |
2.455 |
6219 |
E7300 |
? |
M0 |
2667 MHz |
266 * 10 |
3072 KB |
1066 |
|
66W |
LGA775 |
? |
2.455 |
6547 |
Core 2 Duo E3000 シリーズ(コードネーム不明), 45nm , Dual-Core Desktop Processor |
Unknown... |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
EV |
CV(MHz) |
E3140 |
2008 June |
? |
2133 MHz |
266 * 8 |
1536 KB |
1066 |
? |
? |
LGA 775 |
? |
? |
? |
Merom , 65nm , standard-voltage , Dual-Core Mobile Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Trusted Execution Technology
Virtualization Technology: supported by all models except T5200, T5450 and some T5500
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0 Steppings
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Die size: 143 mm² |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
T5200 |
SL9VP |
B2 |
1600 MHz |
133 * 12 |
2048 KB |
533 |
1.0375 - 1.3 |
34 |
Socket M |
LF80537GE0251M |
OEM |
T5500 |
SL9SH |
B2 |
1667 MHz |
166 * 10 |
2048 KB |
667 |
1.0375 - 1.3 |
34 |
Socket M |
LF80537GF0282M |
Napa64 |
SL9SQ |
FCBGA6 |
LE80537GF0282M |
- |
T5600 |
SL9SG |
B2 |
1833 MHz |
166 * 11 |
2048 KB |
667 |
1.0375 - 1.3 |
34 |
Socket M |
LF80537GF0342M |
Napa64 |
SL9SP |
FCBGA6 |
LE80537GF0342M |
- |
T7200 |
SL9SF |
B2 |
2000 MHz |
166 * 12 |
4096 KB |
667 |
1.0375 - 1.3 |
34 |
Socket M |
LF80537GF0414M |
Napa64 |
SL9SL |
FCBGA6 |
LE80537GF0414M |
- |
T7300 |
SLA45 |
E1 |
2000 MHz |
200 * 10 |
4096 KB |
800 |
1.0375 - 1.3 |
35 |
Socket P |
LF80537GG0414M |
Santa Rosa |
SLA3P |
FCBGA6 |
LE80537GG0414M |
- |
T7400 |
SL9SE |
B2 |
2166 MHz |
166 * 13 |
4096 KB |
667 |
1.0375 - 1.3 |
34 |
Socket M |
LF80537GF0484M |
Napa64 |
SL9SK |
FCBGA6 |
LE80537GF0484M |
- |
T7500 |
SLA44 |
E1 |
2200 MHz |
200 * 11 |
4096 KB |
800 |
1.0375 - 1.3 |
35 |
Socket P |
LF80537GG0494M |
Santa Rosa |
SLA3N |
FCBGA6 |
LE80537GG0494M |
- |
SLAF8 |
G0 |
Socket P |
LF80537GG0494M |
Santa Rosa |
SLADM |
FCBGA6 |
LE80537GG0494M |
- |
T7600 |
SL9SD |
B2 |
2333 MHz |
166 * 14 |
4096 KB |
667 |
1.0375 - 1.3 |
34 |
Socket P |
LF80537GF0534M |
Napa64 |
SL9SJ |
FCBGA6 |
LE80537GF0534M |
- |
T7700 |
SLA43 |
E1 |
2400 MHz |
200 * 12 |
4096 KB |
800 |
1.0375 - 1.3 |
35 |
Socket P |
LF80537GG0564M |
Santa Rosa |
SLA3M |
FCBGA6 |
LE80537GG0564M |
- |
SLAF7 |
G0 |
Socket P |
LF80537GG0564M |
Santa Rosa |
SLADL |
FCBGA6 |
LE80537GG0564M |
- |
T7800 |
SLAF6 |
G0 |
2600 MHz |
200 * 13 |
4096 KB |
800 |
1.0375 - 1.3 |
35 |
Socket P |
LF80537GG0644ML |
Santa Rosa |
SLA75 |
FCBGA6 |
LE80537GG0644M |
- |
Merom , 65nm , low-voltage , Dual-Core Mobile Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0 Steppings
Die size: 143 mm² |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
LV 7200 |
SL9SN |
B2 |
1333 MHz |
166 * 8 |
4096 KB |
667 |
0.9 - 1.2 |
17 |
FCBGA6 |
LE80537LF0144M |
- |
LV 7300 |
SLA3S |
E1 |
1400 MHz |
200 * 7 |
4096 KB |
800 |
0.9 - 1.1 |
17 |
FCBGA6 |
LE80537LG0174M |
- |
LV 7400 |
SL9SM |
B2 |
1500 MHz |
166 * 9 |
4096 KB |
667 |
0.9 - 1.2 |
17 |
FCBGA6 |
LE80537LF0214M |
- |
LV 7500 |
SLA3R |
E1 |
1600 MHz |
200 * 8 |
4096 KB |
800 |
0.9 - 1.1 |
17 |
FCBGA6 |
LE80537LG0254M |
- |
SLAET |
G0 |
LV 7700 |
? |
E1 |
1800 MHz |
200 * 9 |
4096 KB |
800 |
0.9 - 1.1 |
17 |
FCBGA6 |
? |
- |
Merom-2M , 65nm , standard-voltage , Dual-Core Mobile Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), LaGrande Technology (Intel Trusted Execution Technology)
Virtualization Technology: Supported by T5600, T7100, T7250 and some T5500 (those T5500 with stepping L2 only)
Intel Dynamic Front Side Bus Frequency Switching: Supported by M0 Steppings
See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.
Die size: 111 mm² |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
T5250 |
SLA9S |
M0 |
1500 MHz |
166 * 9 |
2048 KB |
667 |
1.0375 - 1.3 |
35 |
Socket P |
? |
OEM |
T5270 |
? |
? |
1400 MHz |
200 * 7 |
2048 KB |
800 |
1.0375 - 1.3 |
35 |
Socket P |
? |
OEM |
T5300 |
SL9WE |
L2 |
1733 MHz |
133 * 13 |
2048 KB |
533 |
1.0375 - 1.3 |
34 |
Socket M |
LF80537GE0302M |
OEM |
T5450 |
SLA4F |
M0 |
1667 MHz |
166 * 10 |
2048 KB |
667 |
1.0375 - 1.3 |
35 |
Socket P |
? |
OEM |
T5470 |
SLAEB |
M0 |
1600 MHz |
200 * 8 |
2048 KB |
800 |
1.0375 - 1.3 |
35 |
Socket P |
? |
OEM |
T5500 |
SL9U4 |
L2 |
1667 MHz |
166 * 10 |
2048 KB |
667 |
1.0375 - 1.3 |
34 |
Socket M |
LF80537GF0282M |
Napa64 |
SL9U8 |
FCBGA6 |
LE80537GF0282M |
- |
T5550 |
SLA4E |
M0 |
1833 MHz |
166 * 11 |
2048 KB |
667 |
1.0375 - 1.3 |
35 |
Socket P |
LF80537GF0342MT |
OEM |
T5600 |
SL9U3 |
L2 |
1833 MHz |
166 * 11 |
2048 KB |
667 |
1.0375 - 1.3 |
34 |
Socket M |
LF80537GF0342M |
Napa64 |
SL9U7 |
FCBGA6 |
LE80537GF0342M |
- |
T5750 |
? |
? |
2000 MHz |
166 * 12 |
2048 KB |
667 |
1.0375 - 1.3 |
35 |
Socket P |
? |
OEM |
T7100 |
SLA4A |
M0 |
1800 MHz |
200 * 9 |
2048 KB |
800 |
1.075 - 1.175 |
35 |
Socket P |
LF80537GG0332M |
Santa Rosa |
SLA3U |
FCBGA6 |
LE80537GG0332M |
- |
T7250 |
SLA49 |
M0 |
2000 MHz |
200 * 10 |
2048 KB |
800 |
1.075 - 1.175 |
35 |
Socket P |
LF80537GG0412M |
Santa Rosa |
SLA3T |
FCBGA6 |
LE80537GG0412M |
- |
Merom-2M , 65nm , ultra-low-voltage , Dual-Core Mobile Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology
Die size: 111 mm² |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
ULV U7500 |
SLA2U |
L2 |
1066 MHz |
133 * 8 |
2048 KB |
533 |
0.750 - 0.925 |
10 |
FCBGA6 |
LE80537UE0042M |
- |
SLV3X |
M0 |
LE80537UE0042M |
ULV U7600 |
SLA2U |
L2 |
1200 MHz |
133 * 9 |
2048 KB |
533 |
0.750 - 0.925 |
10 |
FCBGA6 |
LE80537UE0092M |
- |
SLV3W |
M0 |
LE80537UE0092M |
ULV U7700 |
? |
? |
1333 MHz |
133 * 10 |
2048 KB |
533 |
0.80 - 0.975 |
10 |
FCBGA6 |
? |
- |
Penryn , 45nm , standard-voltage , Dual-Core Mobile Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Die size: 107 mm²
Package size: 35 mm × 35 mm |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
T9300 |
SLAQG |
C0 |
2500 MHz |
200 * 12.5 |
6144 KB |
800 |
1.062 - 1.150 |
35 |
Socket P |
FF80576GG0606M |
Santa Rosa |
SLAPV |
1.00 - 1.250 |
FCBGA6 |
EC80576GG0606M |
- |
T9400 |
May 2008 |
C0 |
2533 MHz |
266 * 9.5 |
6144 KB |
1066 |
? |
35 |
Socket P |
? |
Montevina |
T9500 |
SLAQH |
C0 |
2600 MHz |
200 * 13 |
6144 KB |
800 |
1.062 - 1.150 |
35 |
Socket P |
FF80576GG0646M |
Santa Rosa |
SLAPW |
1.00 - 1.250 |
FCBGA6 |
EC80576GG0646M |
- |
T9600 |
May 2008 |
C0 |
2800 MHz |
266 * 10.5 |
6144 KB |
1066 |
? |
35 |
Socket P |
? |
Montevina |
Penryn , 45nm , medium-voltage , Dual-Core Mobile Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 533-1066 MHz as necessary.
Die size: 107 mm²
Package size: 35 mm × 35 mm |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
P9500 |
May 2008 |
? |
2533 MHz |
266 * 9.5 |
6144 KB |
1066 |
? |
25 |
Socket P |
? |
Montevina |
Penryn , 45nm , medium-voltage , Dual-Core Mobile Processor , Small Form Factor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Die size: 107 mm²
Package size: 22 mm × 22 mm
B1Stepping are Engineering Samples |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
SP9300 |
2008 Q3 |
C0 |
2266 MHz |
266 * 8.5 |
6144 KB |
1066 |
? |
25 |
Socket P |
? |
Montevina |
SP9400 |
2008 Q3 |
C0 |
2400 MHz |
266 * 9 |
6144 KB |
1066 |
? |
25 |
Socket P |
? |
Montevina |
Penryn , 45nm , low-voltage , Dual-Core Mobile Processor , Small Form Factor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Die size: 107 mm²
Package size: 22 mm × 22 mm
B1Stepping are Engineering Samples
|
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
SL9300 |
2008 Q3 |
C0 |
1600 MHz |
266 * 6 |
6144 KB |
1066 |
? |
17 |
Socket P |
? |
Montevina |
SL9400 |
2008 Q3 |
C0 |
1866 MHz |
266 * 7 |
6144 KB |
1066 |
? |
17 |
Socket P |
? |
Montevina |
Penryn-3M , 45nm , standard-voltage , Dual-Core Mobile Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary. |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
T8100 |
SLAP9 |
M0 |
2100 MHz |
200 * 10.5 |
3072 KB |
800 |
1.00 - 1.250 |
35 |
Socket P |
FF80577GG0453M |
Santa Rosa |
SLAPT |
FCBGA6 |
EC80576GG0453M |
- |
T8300 |
SLAPA |
M0 |
2400 MHz |
200 * 12 |
3072 KB |
800 |
1.00 - 1.250 |
35 |
Socket P |
FF80577GG0563M |
Santa Rosa |
SLAPR |
FCBGA6 |
EC80577GG0563M |
- |
Penryn-3M , 45nm , medium-voltage , Dual-Core Mobile Processor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 533-1066 MHz as necessary.
Package size: 35 mm × 35 mm |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
P8400 |
May 2008 |
? |
2266 MHz |
266 * 8.5 |
3072 KB |
1066 |
? |
25 |
Socket P |
? |
Montevina |
P8600 |
May 2008 |
? |
2400 MHz |
266 * 9 |
3072 KB |
1066 |
? |
25 |
Socket P |
? |
Montevina |
Penryn-3M , 45nm , ultra-low-voltage , Dual-Core Mobile Processor , Small Form Factor |
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Package size: 22 mm × 22 mm
B1 Stepping isEngineering Samples |
Number |
sSpec |
Step |
Frequency |
Multiplier |
L2-Cache |
FSB(MT/s) |
Voltage(V) |
TDP(W) |
Package |
Part Number |
Platform |
SU3300 |
2008 Q3 |
C0? |
1200 MHz |
200 * 6 |
3072 KB |
1066 |
? |
5.5 |
Socket P |
? |
Montevina |
SU9300 |
2008 Q3 |
C0 |
1200 MHz |
200 * 6 |
3072 KB |
1066 |
? |
10 |
Socket P |
? |
Montevina |
SU9400 |
2008 Q3 |
C0 |
1400 MHz |
200 * 7 |
3072 KB |
1066 |
? |
10 |
Socket P |
? |
Montevina |
Note [a] |
The L2 Stepping as well as the models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T have better optimizations to lower the idle power consumption from 22W to 12W. |
Note [b] |
The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W. |
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