Intel® Core™2 Duo Processors
Code Name Process Platform Other Memo
Conroe 65nm Desktop Dual-Core
Allendale 65nm Desktop Dual-Core
Wolfdale 45nm Desktop Dual-Core
Wolfdale-3M 45nm Desktop Dual-Core
不明 45nm Desktop? Core2 Duo E3000シリーズ , Dual-Core , 他不明
Merom 65nm Mobile Dual-Core , standard-voltage , low-voltage
Merom-2M 65nm Mobile Dual-Core , standard-voltage , ultra-low-voltage
Penryn 45nm Mobile Dual-Core , standard-voltage , medium-voltag
m
edium-voltage Small Form Factor , low-voltage Small Form Factor
Penryn-3M 45nm Mobile

Dual-Core , standard-voltage , medium-voltage
ultra-low-voltage Small Form Factor

External links
製品詳細(English) , 製品情報(Japanese) , 基本技術詳細

 

Conroe , 65nm , Dual-Core Desktop Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology
The E6540 does not support Intel Trusted Execution Technology.
Die size: 143 mm²
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number EV CV(MHz)
E6300 SL9SA B2 1866 MHz 266 * 7 2048 KB 1066 0.85 - 1.3525 65 LGA 775 HH80557PH0362M 2.380 4441
E6320 SLA4U B2 1866 MHz 266 * 7 4096 KB 1066 1.187 - 1.325 65 LGA 775 HH80557PH0364M 2.530 4121
E6400 SL9S9 B2 2133 MHz 266 * 8 2048 KB 1066 0.85 - 1.3525 65 LGA 775 HH80557PH0462M 2.380 5077
E6420 SLA4T B2 2133 MHz 266 * 8 4096 KB 1066 1.187 - 1.325 65 LGA 775 HH80557PH0464M 2.530 5396
E6540 SLAA5 G0 2333 MHz 333 * 7 4096 KB 1333 0.962 - 1.350 65 LGA 775 HH80557PJ0534M 2.580 6019
E6550 SLA9X G0 2333 MHz 333 * 7 4096 KB 1333 0.962 - 1.350 65 LGA 775 HH80557PJ0534MG 2.580 6019
E6600 SL9S8
SL9ZL
B2 2400 MHz 266 * 9 4096 KB 1066 0.85 - 1.3525 65 LGA 775 HH80557PH0564M 2.530 6072
E6700 SL9S7
SL9ZF
B2 2667 MHz 266 * 10 4096 KB 1066 0.85 - 1.3525 65 LGA 775 HH80557PH0674M 2.530 6748
E6750 SLA9V G0 2667 MHz 333 * 8 4096 KB 1333 0.962 - 1.350 65 LGA 775 HH80557PJ0674MG 2.580 6881
E6850 SLA9U G0 3000 MHz 333 * 9 4096 KB 1333 0.962 - 1.350 65 LGA 775 HH80557PJ0804MG 2.580 7740

 

Allendale , 65nm , Dual-Core Desktop Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Trusted Execution Technology
Virtualization Technology supported by: E6x00 Die
size: 111 mm²
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number EV CV(MHz)
E4300 SL9TB L2 1800 MHz 200 * 9 2048 KB 800 1.225 - 1.325 65 LGA 775 HH80557PG0332M 2.280 4104
E4400 SLA3F L2 2000 MHz 200 * 10 2048 KB 800 1.162 - 1.312 65 LGA 775 HH80557PG0412M 2.280 4560
SLA98 M0 0.962 - 1.325
E4500 SLA95 M0 2200 MHz 200 * 11 2048 KB 800 0.962 - 1.325 65 LGA 775 HH80557PG0492M 2.280 5016
E4600 SLA94 M0 2400 MHz 200 * 12 2048 KB 800 1.162 - 1.312 65 LGA 775 HH80557PG0562M 2.280 5472
E4700 SLALT M0 2600 MHz 200 * 13 2048 KB 800 1.162 - 1.312 65 LGA 775 HH80557PG0642M 2.280 5928
E6300 SL9TA L2 1866 MHz 266 * 7 2048 KB 1066 1.225 - 1.325 65 LGA 775 HH80557PH0362M 2.380 4441
E6400 SL9T9 L2 2133 MHz 266 * 8 2048 KB 1066 1.225 - 1.325 65 LGA 775 HH80557PH0462M 2.380 5077

 

Wolfdale , 45nm , Dual-Core Desktop Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology], Trusted Execution Technology.
E8190 does not support Intel Trusted Execution Technology.
Die size: 107 mm²
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number EV CV(MHz)
E8190 SLAQR C0 2667 MHz 333 * 8 6144 KB 1333 0.85 – 1.3625 65 LGA 775 EU80570PJ0676MN 2.655 7081
E8200 SLAPP C0 2667 MHz 333 * 8 6144 KB 1333 0.85 – 1.3625 65 LGA 775 EU80570PJ0676M 2.655 7081
E8300 April 20, 2008 C0 2833 MHz 333 * 8.5 6144 KB 1333 0.85 – 1.3625 65 LGA 775 EU80570PJ0736M 2.655 7522
E8400 SLAPL C0 3000 MHz 333 * 9 6144 KB 1333 0.85 – 1.3625 65 LGA 775 EU80570PJ0806M 2.655 7965
E8500 SLAPK C0 3166 MHz 333 * 9.5 6144 KB 1333 0.85 – 1.3625 65 LGA 775 EU80570PJ0876M 2.655 8406
E8600 2008 Q3 C0 3333 MHz 333 * 10 6144 KB 1333 0.85 – 1.3625 65 LGA 775 ? 2.655 8849

 

Wolfdale-3M , 45nm , Dual-Core Desktop Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management)
Die size: 107 mm²
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number EV CV(MHz)
E7200 SLAPC
SLAVN
M0 2533 MHz 266 * 9.5 3072 KB 1066 0.85 – 1.3625 65W LGA 775 EU80571PH0613M 2.455 6219
E7300 ? M0 2667 MHz 266 * 10 3072 KB 1066   66W LGA775 ? 2.455 6547

 

Core 2 Duo E3000 シリーズ(コードネーム不明), 45nm , Dual-Core Desktop Processor
Unknown...
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number EV CV(MHz)
E3140 2008 June ? 2133 MHz 266 * 8 1536 KB 1066 ? ? LGA 775 ? ? ?

 

Merom , 65nm , standard-voltage , Dual-Core Mobile Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Trusted Execution Technology
Virtualization Technology: supported by all models except T5200, T5450 and some T5500
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0 Steppings
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Die size: 143 mm²
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
T5200 SL9VP B2 1600 MHz 133 * 12 2048 KB 533 1.0375 - 1.3 34 Socket M LF80537GE0251M OEM
T5500 SL9SH B2 1667 MHz 166 * 10 2048 KB 667 1.0375 - 1.3 34 Socket M LF80537GF0282M Napa64
SL9SQ FCBGA6 LE80537GF0282M -
T5600 SL9SG B2 1833 MHz 166 * 11 2048 KB 667 1.0375 - 1.3 34 Socket M LF80537GF0342M Napa64
SL9SP FCBGA6 LE80537GF0342M -
T7200 SL9SF B2 2000 MHz 166 * 12 4096 KB 667 1.0375 - 1.3 34 Socket M LF80537GF0414M Napa64
SL9SL FCBGA6 LE80537GF0414M -
T7300 SLA45 E1 2000 MHz 200 * 10 4096 KB 800 1.0375 - 1.3 35 Socket P LF80537GG0414M Santa Rosa
SLA3P FCBGA6 LE80537GG0414M -
T7400 SL9SE B2 2166 MHz 166 * 13 4096 KB 667 1.0375 - 1.3 34 Socket M LF80537GF0484M Napa64
SL9SK FCBGA6 LE80537GF0484M -
T7500 SLA44 E1 2200 MHz 200 * 11 4096 KB 800 1.0375 - 1.3 35 Socket P LF80537GG0494M Santa Rosa
SLA3N FCBGA6 LE80537GG0494M -
SLAF8 G0 Socket P LF80537GG0494M Santa Rosa
SLADM FCBGA6 LE80537GG0494M -
T7600 SL9SD B2 2333 MHz 166 * 14 4096 KB 667 1.0375 - 1.3 34 Socket P LF80537GF0534M Napa64
SL9SJ FCBGA6 LE80537GF0534M -
T7700 SLA43 E1 2400 MHz 200 * 12 4096 KB 800 1.0375 - 1.3 35 Socket P LF80537GG0564M Santa Rosa
SLA3M FCBGA6 LE80537GG0564M -
SLAF7 G0 Socket P LF80537GG0564M Santa Rosa
SLADL FCBGA6 LE80537GG0564M -
T7800 SLAF6 G0 2600 MHz 200 * 13 4096 KB 800 1.0375 - 1.3 35 Socket P LF80537GG0644ML Santa Rosa
SLA75 FCBGA6 LE80537GG0644M -

 

Merom , 65nm , low-voltage , Dual-Core Mobile Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0 Steppings
Die size: 143 mm²
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
LV 7200 SL9SN B2 1333 MHz 166 * 8 4096 KB 667 0.9 - 1.2 17 FCBGA6 LE80537LF0144M -
LV 7300 SLA3S E1 1400 MHz 200 * 7 4096 KB 800 0.9 - 1.1 17 FCBGA6 LE80537LG0174M -
LV 7400 SL9SM B2 1500 MHz 166 * 9 4096 KB 667 0.9 - 1.2 17 FCBGA6 LE80537LF0214M -
LV 7500 SLA3R E1 1600 MHz 200 * 8 4096 KB 800 0.9 - 1.1 17 FCBGA6 LE80537LG0254M -
SLAET G0
LV 7700 ? E1 1800 MHz 200 * 9 4096 KB 800 0.9 - 1.1 17 FCBGA6 ? -

 

Merom-2M , 65nm , standard-voltage , Dual-Core Mobile Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), LaGrande Technology (Intel Trusted Execution Technology)
Virtualization Technology: Supported by T5600, T7100, T7250 and some T5500 (those T5500 with stepping L2 only)
Intel Dynamic Front Side Bus Frequency Switching: Supported by M0 Steppings
See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.
Die size: 111 mm²
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
T5250 SLA9S M0 1500 MHz 166 * 9 2048 KB 667 1.0375 - 1.3 35 Socket P ? OEM
T5270 ? ? 1400 MHz 200 * 7 2048 KB 800 1.0375 - 1.3 35 Socket P ? OEM
T5300 SL9WE L2 1733 MHz 133 * 13 2048 KB 533 1.0375 - 1.3 34 Socket M LF80537GE0302M OEM
T5450 SLA4F M0 1667 MHz 166 * 10 2048 KB 667 1.0375 - 1.3 35 Socket P ? OEM
T5470 SLAEB M0 1600 MHz 200 * 8 2048 KB 800 1.0375 - 1.3 35 Socket P ? OEM
T5500 SL9U4 L2 1667 MHz 166 * 10 2048 KB 667 1.0375 - 1.3 34 Socket M LF80537GF0282M Napa64
SL9U8 FCBGA6 LE80537GF0282M -
T5550 SLA4E M0 1833 MHz 166 * 11 2048 KB 667 1.0375 - 1.3 35 Socket P LF80537GF0342MT OEM
T5600 SL9U3 L2 1833 MHz 166 * 11 2048 KB 667 1.0375 - 1.3 34 Socket M LF80537GF0342M Napa64
SL9U7 FCBGA6 LE80537GF0342M -
T5750 ? ? 2000 MHz 166 * 12 2048 KB 667 1.0375 - 1.3 35 Socket P ? OEM
T7100 SLA4A M0 1800 MHz 200 * 9 2048 KB 800 1.075 - 1.175 35 Socket P LF80537GG0332M Santa Rosa
SLA3U FCBGA6 LE80537GG0332M -
T7250 SLA49 M0 2000 MHz 200 * 10 2048 KB 800 1.075 - 1.175 35 Socket P LF80537GG0412M Santa Rosa
SLA3T FCBGA6 LE80537GG0412M -

 

Merom-2M , 65nm , ultra-low-voltage , Dual-Core Mobile Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology
Die size: 111 mm²
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
ULV U7500 SLA2U L2 1066 MHz 133 * 8 2048 KB 533 0.750 - 0.925 10 FCBGA6 LE80537UE0042M -
SLV3X M0 LE80537UE0042M
ULV U7600 SLA2U L2 1200 MHz 133 * 9 2048 KB 533 0.750 - 0.925 10 FCBGA6 LE80537UE0092M -
SLV3W M0 LE80537UE0092M
ULV U7700 ? ? 1333 MHz 133 * 10 2048 KB 533 0.80 - 0.975 10 FCBGA6 ? -

 

Penryn , 45nm , standard-voltage , Dual-Core Mobile Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Die size: 107 mm²
Package size: 35 mm × 35 mm
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
T9300 SLAQG C0 2500 MHz 200 * 12.5 6144 KB 800 1.062 - 1.150 35 Socket P FF80576GG0606M Santa Rosa
SLAPV 1.00 - 1.250 FCBGA6 EC80576GG0606M -
T9400 May 2008 C0 2533 MHz 266 * 9.5 6144 KB 1066 ? 35 Socket P ? Montevina
T9500 SLAQH C0 2600 MHz 200 * 13 6144 KB 800 1.062 - 1.150 35 Socket P FF80576GG0646M Santa Rosa
SLAPW 1.00 - 1.250 FCBGA6 EC80576GG0646M -
T9600 May 2008 C0 2800 MHz 266 * 10.5 6144 KB 1066 ? 35 Socket P ? Montevina

 

Penryn , 45nm , medium-voltage , Dual-Core Mobile Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 533-1066 MHz as necessary.
Die size: 107 mm²
Package size: 35 mm × 35 mm
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
P9500 May 2008 ? 2533 MHz 266 * 9.5 6144 KB 1066 ? 25 Socket P ? Montevina

 

Penryn , 45nm , medium-voltage , Dual-Core Mobile Processor , Small Form Factor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Die size: 107 mm²
Package size: 22 mm × 22 mm
B1Stepping are Engineering Samples
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
SP9300 2008 Q3 C0 2266 MHz 266 * 8.5 6144 KB 1066 ? 25 Socket P ? Montevina
SP9400 2008 Q3 C0 2400 MHz 266 * 9 6144 KB 1066 ? 25 Socket P ? Montevina

 

Penryn , 45nm , low-voltage , Dual-Core Mobile Processor , Small Form Factor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Die size: 107 mm²
Package size: 22 mm × 22 mm
B1Stepping are Engineering Samples
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
SL9300 2008 Q3 C0 1600 MHz 266 * 6 6144 KB 1066 ? 17 Socket P ? Montevina
SL9400 2008 Q3 C0 1866 MHz 266 * 7 6144 KB 1066 ? 17 Socket P ? Montevina

 

Penryn-3M , 45nm , standard-voltage , Dual-Core Mobile Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
T8100 SLAP9 M0 2100 MHz 200 * 10.5 3072 KB 800 1.00 - 1.250 35 Socket P FF80577GG0453M Santa Rosa
SLAPT FCBGA6 EC80576GG0453M -
T8300 SLAPA M0 2400 MHz 200 * 12 3072 KB 800 1.00 - 1.250 35 Socket P FF80577GG0563M Santa Rosa
SLAPR FCBGA6 EC80577GG0563M -

Penryn-3M , 45nm , medium-voltage , Dual-Core Mobile Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 533-1066 MHz as necessary.
Package size: 35 mm × 35 mm
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
P8400 May 2008 ? 2266 MHz 266 * 8.5 3072 KB 1066 ? 25 Socket P ? Montevina
P8600 May 2008 ? 2400 MHz 266 * 9 3072 KB 1066 ? 25 Socket P ? Montevina

Penryn-3M , 45nm , ultra-low-voltage , Dual-Core Mobile Processor , Small Form Factor
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 (Intel's x86-64 implementation), XD bit (an NX bit implementation), iAMT2 (Intel Active Management), Virtualization Technology, Trusted Execution Technology, IDA (Intel Dynamic Acceleration)
Socket P processors are capable of throttling the FSB anywhere between 400-800 MHz as necessary.
Package size: 22 mm × 22 mm
B1 Stepping isEngineering Samples
Number sSpec Step Frequency Multiplier L2-Cache FSB(MT/s) Voltage(V) TDP(W) Package Part Number Platform
SU3300 2008 Q3 C0? 1200 MHz 200 * 6 3072 KB 1066 ? 5.5 Socket P ? Montevina
SU9300 2008 Q3 C0 1200 MHz 200 * 6 3072 KB 1066 ? 10 Socket P ? Montevina
SU9400 2008 Q3 C0 1400 MHz 200 * 7 3072 KB 1066 ? 10 Socket P ? Montevina

 

Note [a]
The L2 Stepping as well as the models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T have better optimizations to lower the idle power consumption from 22W to 12W.
Note [b]
The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

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